View MCP41010MCP42010_242392.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

M
Features
* 256 taps for each potentiometer * Potentiometer values for 10 k, 50 k and 100 k * Single and dual versions * SPITM serial interface (mode 0,0 and 1,1) * 1 LSB max INL & DNL * Low power CMOS technology * 1 A maximum supply current in static operation * Multiple devices can be daisy-chained together (MCP42XXX only) * Shutdown feature open circuits of all resistors for maximum power savings * Hardware shutdown pin available on MCP42XXX only * Single supply operation (2.7V - 5.5V) * Industrial temperature range: -40C to +85C * Extended temperature range: -40C to +125C
MCP41XXX/42XXX
Description
The MCP41XXX and MCP42XXX devices are 256position, digital potentiometers available in 10 k, 50 k and 100 k resistance versions. The MCP41XXX is a single-channel device and is offered in an 8-pin PDIP or SOIC package. The MCP42XXX contains two independent channels in a 14-pin PDIP, SOIC or TSSOP package. The wiper position of the MCP41XXX/42XXX varies linearly and is controlled via an industry-standard SPI interface. The devices consume <1 A during static operation. A software shutdown feature is provided that disconnects the "A" terminal from the resistor stack and simultaneously connects the wiper to the "B" terminal. In addition, the dual MCP42XXX has a SHDN pin that performs the same function in hardware. During shutdown mode, the contents of the wiper register can be changed and the potentiometer returns from shutdown to the new value. The wiper is reset to the mid-scale position (80h) upon power-up. The RS (reset) pin implements a hardware reset and also returns the wiper to mid-scale. The MCP42XXX SPI interface includes both the SI and SO pins, allowing daisy-chaining of multiple devices. Channel-to-channel resistance matching on the MCP42XXX varies by less than 1%. These devices operate from a single 2.7 - 5.5V supply and are specified over the extended and industrial temperature ranges.
Single/Dual Digital Potentiometer with SPITM Interface
Block Diagram
RS VDD VSS Control Logic Wiper Register SHDN PB0 Resistor Array 0 PA0 PW0 PB1 PA1 PW1
Package Types
PDIP/SOIC
CS SCK SI VSS 1 2 3 4 8 7 6 5 VDD PB0 PW0 PA0 MCP41XXX
CS SI SCK
16-Bit Shift Register S0
Wiper Resistor Register Array 1*
*Potentiometer P1 is only available on the dual MCP42XXX version.
PDIP/SOIC/TSSOP
CS SCK SI VSS PB1 PW1 PA1 1 2 3 4 5 6 7 14 13 12 11 10 9 8 VDD SO SHDN RS PB0 PW0 PA0
MCP42XXX
2003 Microchip Technology Inc.
DS11195C-page 1
MCP41XXX/42XXX
1.0 ELECTRICAL CHARACTERISTICS DC CHARACTERISTICS: 10 k VERSION
Electrical Characteristics: Unless otherwise indicated, VDD = +2.7V to 5.5V, TA = -40C to +85C (TSSOP devices are only specified at +25C and +85C). Typical specifications represent values for VDD = 5V, VSS = 0V, VB = 0V, TA = +25C. Parameters Rheostat Mode Nominal Resistance Rheostat Differential Non Linearity Rheostat Integral Non Linearity Rheostat Tempco Wiper Resistance Wiper Current Nominal Resistance Match Potentiometer Divider Resolution Monotonicity Differential Non-Linearity Integral Non-Linearity Voltage Divider Tempco Full Scale Error Zero Scale Error Resistor Terminals Voltage Range Capacitance (CA or CB) Capacitance Bandwidth -3dB Settling Time Resistor Noise Voltage Crosstalk Schmitt Trigger High-Level Input Voltage Schmitt Trigger Low-Level Input Voltage Hysteresis of Schmitt Trigger Inputs Low-Level Output Voltage High-Level Output Voltage Input Leakage Current Pin Capacitance (All inputs/outputs) Power Requirements Operating Voltage Range Supply Current, Active Supply Current, Static Power Supply Sensitivity Note 1: 2: 3: 4: 5: 6: VDD IDDA IDDS PSS PSS 2.7 -- -- -- -- -- 340 0.01 0.0015 0.0015 5.5 500 1 0.0035 0.0035 V A A %/% %/% VDD = 5.5V, CS = VSS, fSCK = 10 MHz, SO = Open, Code FFh (Note 6) CS, SHDN, RS = VDD = 5.5V, SO = Open (Note 6) VDD = 4.5V - 5.5V, VA = 4.5V, Code 80h VDD = 2.7V - 3.3V, VA = 2.7V, Code 80h CW BW tS eNWB CT VIH VIL VHYS VOL VOH ILI CIN, COUT VA,B,W 0 -- -- -- -- -- -- 0.7VDD -- -- -- VDD - 0.5 -1 -- -- 15 5.6 1 2 9 -95 -- -- 0.05VDD -- -- -- 10 VDD -- -- -- -- -- -- -- 0.3VDD -- 0.40 -- +1 -- V V A pF IOL = 2.1 mA, VDD = 5V IOH = -400 A, VDD = 5V CS = VDD, VIN = VSS or VDD, includes VA SHDN=0 VDD = 5.0V, TA = +25C, fc = 1 MHz pF pF MHz S nV/Hz dB V V Note 4 f = 1 MHz, Code = 80h, see Figure 2-30 f = 1 MHz, Code = 80h, see Figure 2-30 VB = 0V, Measured at Code 80h, Output Load = 30 PF VA = VDD,VB = 0V, 1% Error Band, Transition from Code 00h to Code 80h, Output Load = 30 pF VA = Open, Code 80h, f =1 kHz VA = VDD, VB = 0V (Note 5) N N DNL INL VW/T VWFSE VWFSE VWZSE VWZSE 8 8 -1 -1 -- -2 -2 0 0 -- -- 1/4 1/4 1 -0.7 -0.7 +0.7 +0.7 -- -- +1 +1 -- 0 0 +2 +2 Bits Bits LSB LSB LSB LSB LSB LSB Note 3 Note 3 Code FFh, VDD = 5V, see Figure 2-25 Code FFh, VDD = 3V, see Figure 2-25 Code 00h, VDD = 5V, see Figure 2-25 Code 00h, VDD = 3V, see Figure 2-25 R R-DNL R-INL RAB/T RW RW IW R/R 8 -1 -1 -- -- -- -1 -- 10 1/4 1/4 800 52 73 -- 0.2 12 +1 +1 -- 100 125 +1 1 k LSB LSB ppm/C mA % MCP42010 only, P0 to P1; TA = +25C VDD = 5.5V, IW = 1 mA, code 00h VDD = 2.7V, IW = 1 mA, code 00h TA = +25C (Note 1) Note 2 Note 2 Sym Min Typ Max Units Conditions
ppm/C Code 80h
Dynamic Characteristics (All dynamic characteristics use VDD = 5V)
Digital Inputs/Outputs (CS, SCK, SI, SO) See Figure 2-12 for RS and SHDN pin operation
VAB = VDD, no connection on wiper. Rheostat position non-linearity R-INL is the deviation from an ideal value measured between the maximum resistance and the minimum resistance wiper positions. R-DNL measures the relative step change from the ideal between successive tap positions. IW = 50 A for VDD = 3V and IW = 400 A for VDD = 5V for 10 k version. See Figure 2-26 for test circuit. INL and DNL are measured at VW with the device configured in the voltage divider or potentiometer mode. VA = VDD and VB = 0V. DNL specification limits of 1 LSB max are specified monotonic operating conditions. See Figure 2-25 for test circuit. Resistor terminals A,B and W have no restrictions on polarity with respect to each other. Full-scale and zero-scale error were measured using Figure 2-25. Measured at VW pin where the voltage on the adjacent VW pin is swinging full-scale. Supply current is independent of current through the potentiometers.
DS11195C-page 2
2003 Microchip Technology Inc.
MCP41XXX/42XXX
DC CHARACTERISTICS: 50 k VERSION
Electrical Characteristics: Unless otherwise indicated, VDD = +2.7V to 5.5V, TA = -40C to +85C (TSSOP devices are only specified at +25C and +85C). Typical specifications represent values for VDD = 5V, VSS = 0V, VB = 0V, TA = +25C. Parameters Rheostat Mode Nominal Resistance Rheostat Differential Non-Linearity Rheostat Integral Non-Linearity Rheostat Tempco Wiper Resistance Wiper Current Nominal Resistance Match Potentiometer Divider Resolution Monotonicity Differential Non-Linearity Integral Non-Linearity Voltage Divider Tempco Full-Scale Error Zero-Scale Error Resistor Terminals Voltage Range Capacitance (CA or CB) Capacitance Bandwidth -3dB Settling Time Resistor Noise Voltage Crosstalk Schmitt Trigger High-Level Input Voltage Schmitt Trigger Low-Level Input Voltage Hysteresis of Schmitt Trigger Inputs Low-Level Output Voltage High-Level Output Voltage Input Leakage Current Pin Capacitance (All inputs/outputs) Power Requirements Operating Voltage Range Supply Current, Active Supply Current, Static Power Supply Sensitivity Note 1: 2: 3: 4: 5: 6: VDD IDDA IDDS PSS PSS 2.7 -- -- -- -- -- 340 0.01 0.0015 0.0015 5.5 500 1 0.0035 0.0035 V A A %/% %/% VDD = 5.5V, CS = VSS, fSCK = 10 MHz, SO = Open, Code FFh (Note 6) CS, SHDN, RS = VDD = 5.5V, SO = Open (Note 6) VDD = 4.5V - 5.5V, VA = 4.5V, Code 80h VDD = 2.7V - 3.3V, VA = 2.7V, Code 80h CW BW tS eNWB CT VIH VIL VHYS VOL VOH ILI CIN, COUT VA,B,W 0 -- -- -- -- -- -- 0.7VDD -- -- -- VDD - 0.5 -1 -- -- 11 5.6 280 8 20 -95 -- -- 0.05VDD -- -- -- 10 VDD -- -- -- -- -- -- -- 0.3VDD -- 0.40 -- +1 -- V V A pF IOL = 2.1 mA, VDD = 5V IOH = -400 A, VDD = 5V CS = VDD, VIN = VSS or VDD, includes VA SHDN=0 VDD = 5.0V, TA = +25C, fc = 1 MHz pF pF MHz S nV/Hz dB V V Note 4 f =1 MHz, Code = 80h, see Figure 2-30 f =1 MHz, Code = 80h, see Figure 2-30 VB = 0V, Measured at Code 80h, Output Load = 30 PF VA = VDD,VB = 0V, 1% Error Band, Transition from Code 00h to Code 80h, Output Load = 30 pF VA = Open, Code 80h, f =1 kHz VA = VDD, VB = 0V (Note 5) N N DNL INL VW/T VWFSE VWFSE VWZSE VWZSE 8 8 -1 -1 -- -1 -1 0 0 -- -- 1/4 1/4 1 -0.25 -0.35 +0.25 +0.35 -- -- +1 +1 -- 0 0 +1 +1 Bits Bits LSB LSB LSB LSB LSB LSB Note 3 Note 3 Code FFh, VDD = 5V, see Figure 2-25 Code FFh, VDD = 3V, see Figure 2-25 Code 00h, VDD = 5V, see Figure 2-25 Code 00h, VDD = 3V, see Figure 2-25 R R-DNL R-INL RAB/T RW RW IW R/R 35 -1 -1 -- -- -- -1 -- 50 1/4 1/4 800 125 175 -- 0.2 65 +1 +1 -- 175 250 +1 1 k LSB LSB ppm/C mA % MCP42050 only, P0 to P1;TA = +25C VDD = 5.5V, IW = 1 mA, code 00h VDD = 2.7V, IW = 1 mA, code 00h TA = +25C (Note 1) Note 2 Note 2 Sym Min Typ Max Units Conditions
ppm/C Code 80h
Dynamic Characteristics (All dynamic characteristics use VDD = 5V)
Digital Inputs/Outputs (CS, SCK, SI, SO) See Figure 2-12 for RS and SHDN pin operation.
VAB = VDD, no connection on wiper. Rheostat position non-linearity R-INL is the deviation from an ideal value measured between the maximum resistance and the minimum resistance wiper positions. R-DNL measures the relative step change from the ideal between successive tap positions. IW = VDD/R for +3V or +5V for 50 k version. See Figure 2-26 for test circuit. INL and DNL are measured at VW with the device configured in the voltage divider or potentiometer mode. VA = VDD and VB = 0V. DNL specification limits of 1 LSB max are specified monotonic operating conditions. See Figure 2-25 for test circuit. Resistor terminals A,B and W have no restrictions on polarity with respect to each other. Full-scale and zero-scale error were measured using Figure 2-25. Measured at VW pin where the voltage on the adjacent VW pin is swinging full scale. Supply current is independent of current through the potentiometers.
2003 Microchip Technology Inc.
DS11195C-page 3
MCP41XXX/42XXX
DC CHARACTERISTICS: 100 k VERSION
Electrical Characteristics: Unless otherwise indicated, VDD = +2.7V to 5.5V, TA = -40C to +85C (TSSOP devices are only specified at +25C and +85C). Typical specifications represent values for VDD = 5V, VSS = 0V, VB = 0V, TA = +25C. Parameters Rheostat Mode Nominal Resistance Rheostat Differential Non-Linearity Rheostat Integral Non-Linearity Rheostat Tempco Wiper Resistance Wiper Current Nominal Resistance Match Potentiometer Divider Resolution Monotonicity Differential Non-Linearity Integral Non-Linearity Voltage Divider Tempco Full-Scale Error Zero-Scale Error Resistor Terminals Voltage Range Capacitance (CA or CB) Capacitance Bandwidth -3dB Settling Time Resistor Noise Voltage Crosstalk Schmitt Trigger High-Level Input Voltage Schmitt Trigger Low-Level Input Voltage Hysteresis of Schmitt Trigger Inputs Low-Level Output Voltage High-Level Output Voltage Input Leakage Current Pin Capacitance (All inputs/outputs) Power Requirements Operating Voltage Range Supply Current, Active Supply Current, Static Power Supply Sensitivity Note 1: 2: 3: 4: 5: 6: VDD IDDA IDDS PSS PSS 2.7 -- -- -- -- -- 340 0.01 0.0015 0.0015 5.5 500 1 0.0035 0.0035 V A A %/% %/% VDD = 5.5V, CS = VSS, fSCK = 10 MHz, SO = Open, Code FFh (Note 6) CS, SHDN, RS = VDD = 5.5V, SO = Open (Note 6) VDD = 4.5V - 5.5V, VA = 4.5V, Code 80h VDD = 2.7V - 3.3V, VA = 2.7V, Code 80h CW BW tS eNWB CT VIH VIL VHYS VOL VOH ILI CIN, COUT VA,B,W 0 -- -- -- -- -- -- 0.7VDD -- -- -- VDD - 0.5 -1 -- -- 11 5.6 145 18 29 -95 -- -- 0.05VDD -- -- -- 10 VDD -- -- -- -- -- -- -- 0.3VDD -- 0.40 -- +1 -- V V A pF IOL = 2.1 mA, VDD = 5V IOH = -400 A, VDD = 5V CS = VDD, VIN = VSS or VDD, includes VA SHDN=0 VDD = 5.0V, TA = +25C, fc = 1 MHz pF pF MHz S nV/Hz dB V V Note 4 f =1 MHz, Code = 80h, see Figure 2-30 f =1 MHz, Code = 80h, see Figure 2-30 VB = 0V, Measured at Code 80h, Output Load = 30 PF VA = VDD,VB = 0V, 1% Error Band, Transition from Code 00h to Code 80h, Output Load = 30 pF VA = Open, Code 80h, f =1 kHz VA = VDD, VB = 0V (Note 5) N N DNL INL VW/T VWFSE VWFSE VWZSE VWZSE 8 8 -1 -1 -- -1 -1 0 0 -- -- 1/4 1/4 1 -0.25 -0.35 +0.25 +0.35 -- -- +1 +1 -- 0 0 +1 +1 Bits Bits LSB LSB LSB LSB LSB LSB Note 3 Note 3 Code FFh, VDD = 5V, see Figure 2-25 Code FFh, VDD = 3V, see Figure 2-25 Code 00h, VDD = 5V, see Figure 2-25 Code 00h, VDD = 3V, see Figure 2-25 R R-DNL R-INL RAB/T RW RW IW R/R 70 -1 -1 -- -- -- -1 -- 100 1/4 1/4 800 125 175 -- 0.2 130 +1 +1 -- 175 250 +1 1 k LSB LSB ppm/C mA % MCP42010 only, P0 to P1;TA = +25C VDD = 5.5V, IW = 1 mA, code 00h VDD = 2.7V, IW = 1 mA, code 00h TA = +25C (Note 1) Note 2 Note 2 Sym Min Typ Max Units Conditions
ppm/C Code 80h
Dynamic Characteristics (All dynamic characteristics use VDD = 5V.)
Digital Inputs/Outputs (CS, SCK, SI, SO) See Figure 2-12 for RS and SHDN pin operation.
VAB = VDD, no connection on wiper. Rheostat position non-linearity R-INL is the deviation from an ideal value measured between the maximum resistance and the minimum resistance wiper positions. R-DNL measures the relative step change from the ideal between successive tap positions. IW = 50 A for VDD = 3V and IW = 400 A for VDD = 5V for 10 k version. See Figure 2-26 for test circuit. INL and DNL are measured at VW with the device configured in the voltage divider or potentiometer mode. VA = VDD and VB = 0V. DNL specification limits of 1 LSB max are specified monotonic operating conditions. See Figure 2-25 for test circuit. Resistor terminals A,B and W have no restrictions on polarity with respect to each other. Full-scale and zero-scale error were measured using Figure 2-25. Measured at VW pin where the voltage on the adjacent VW pin is swinging full-scale. Supply current is independent of current through the potentiometers.
DS11195C-page 4
2003 Microchip Technology Inc.
MCP41XXX/42XXX
Absolute Maximum Ratings
VDD...................................................................................7.0V All inputs and outputs w.r.t. VSS ............... -0.6V to VDD +1.0V Storage temperature .....................................-60C to +150C Ambient temp. with power applied ................-60C to +125C ESD protection on all pins .................................................. 2 kV Notice: Stresses above those listed under "maximum ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
AC TIMING CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, VDD = +2.7V to 5.5V, TA = -40C to +85C. Parameter Clock Frequency Clock High Time Clock Low Time CS Fall to First Rising CLK Edge Data Input Setup Time Data Input Hold Time SCK Fall to SO Valid Propagation Delay SCK Rise to CS Rise Hold Time SCK Rise to CS Fall Delay CS Rise to CLK Rise Hold CS High Time Reset Pulse Width RS Rising to CS Falling Delay Time CS rising to RS or SHDN falling delay time CS low time Shutdown Pulse Width Note 1: 2: 3: Sym FCLK tHI tLO tCSSR tSU tHD tDO tCHS tCS0 tCS1 tCSH tRS tRSCS tSE tCSL tSH 30 10 100 40 150 150 40 100 150 Min. -- 40 40 40 40 10 Typ. -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Max. 10 -- -- -- -- -- 80 -- -- -- -- -- -- -- -- -- Units MHz ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Note 2 Note 2 Note 3 Note 3 Note 3 CL = 30 pF (Note 2) Conditions VDD = 5V (Note 1)
When using the device in the daisy-chain configuration, maximum clock frequency is determined by a combination of propagation delay time (tDO) and data input setup time (tSU). Max. clock frequency is therefore ~ 5.8 MHz based on SCK rise and fall times of 5 ns, tHI = 40 ns, tDO = 80 ns and tSU = 40 ns. Applies only to the MCP42XXX devices. Applies only when using hardware pins to exit software shutdown mode, MCP42XXX only.
2003 Microchip Technology Inc.
DS11195C-page 5
MCP41XXX/42XXX
tCSH CS tCSSR tCSO SCK tSU tHD msb in tDO SO VOUT (First 16 bits out are always zeros) tS 1% Error Band 1% 1/FCLK tHI tLO tCHS tCS1
SI
FIGURE 1-1:
Detailed Serial interface Timing.
Wiper position is changed to mid-scale (80h) if RS is held low for 150 ns CS
Code 80h is latched on rising edge of RS
tRSCS tRS RS tS VOUT 1% Error Band 1%
FIGURE 1-2:
Reset Timing.
tCSL CS tSE RS tRS
tSE tSH SHDN
FIGURE 1-3:
Software Shutdown Exit Timing.
DS11195C-page 6
2003 Microchip Technology Inc.
MCP41XXX/42XXX
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, curve represents 10 k, 50 k and 100 k devices, VDD = 5V, VSS = 0V, TA = +25C, VB = 0V.
1 Normalized Resistance () 0.8 0.6 0.4
RWB RWA
14
VDD = +3V to +5V
Nominal Resistance (k)
12 10 8 6 4 2 0
RAB
RWB Code = 80h
0.2 0 0 32 64 96 128 160 Code (Decimal) 192 224 256
MCP41010, MCP42010 (10 k potentiometers)
-40 -25 -10
5
20 35 50 65 80 95 110 125 Temperature (C)
FIGURE 2-1: Normalized Wiper to End Terminal Resistance vs. Code.
0.5 0.4 0.3 0.2 0.1 0 -0.1 -0.2 -0.3 -0.4 -0.5 0 32 64 96 Potentiometer INL Error (LSB)
FIGURE 2-4: vs. Temperature.
70 Nominal Resistance (k) 60 50 40 30 20 10
Nominal Resistance 10 k
TA = -40C to +85C Refer to Figure 2-25
RAB
RWB Code = 80h MCP41050, MCP42050 (50 k potentiometers)
128 160 192 224 256
0 -40 -25 -10
5
20
35
50
65
80
95 110 125
Code (Decimal)
Temperature (C)
FIGURE 2-2: Code.
Potentiometer Mode TempCo (ppm / C)
70 60 50 40 30 20 10 0 -10 0 32 64
Potentiometer INL Error vs.
FIGURE 2-5: vs. Temperature.
140 Nominal Resistance (k) 120 100 80 60 40 20
Nominal Resistance 50 k
TA = -40C to +85C VA = 3V
RAB RWB Code = 80h
96
128
160
192
224
256
0 -40 -25 -10
MCP41100, MCP42100 (100 k potentiometers)
5
20
35
50
65
80
95 110 125
Code (Decimal)
Temperature (C)
FIGURE 2-3: Potentiometer Mode Tempco vs. Code.
FIGURE 2-6: vs. Temperature.
Nominal Resistance 100 k
2003 Microchip Technology Inc.
DS11195C-page 7
MCP41XXX/42XXX
Note: Unless otherwise indicated, curve represents 10 k, 50 k and 100 k devices, VDD = 5V, VSS = 0V, TA = +25C, VB = 0V.
0.5 0.4 0.3 0.2 0.1 0 -0.1 -0.2 -0.3 -0.4 -0.5 0 32 64
Active Supply Current (A)
Refer to Figure 2-27
280 230 180 130 80 30 -40 -25 -10 5 20 35 50 65 80 95 110 125 Temperature (C)
VDD = 3V VDD = 5V FCLK = 3 MHz Code = FFh
Rheostat INL Error (LSB)
TA = +85C TA = +25C
TA = -40C
96 128 160 Code (Decimal)
192
224
256
FIGURE 2-7: Code.
3000 Rheostat Mode TempCo (ppm / C) 2500 2000 1500 1000 500 0 0 32
Rheostat INL Error vs.
FIGURE 2-10: Temperature.
1000 Active Supply Current (mA) 900 800 700 600 500 400 300 200 100 0
Active Supply Current vs.
TA = -40C to +85C, VA = no connect, RWB measured
A - VDD = 5.5V, Code = AAh B - VDD = 3.3V, Code = AAh C - VDD = 5.5V, Code = FFh D - VDD = 3.3V, Code = FFh
B
A C
D
64
96
128 160 192 224 256
1k
10k
Code (Decimal)
100k 1M Clock Frequency (Hz)
10M
FIGURE 2-8: Code.
1000 Static Current (nA)
Rheostat Mode Tempco vs.
FIGURE 2-11: Clock Frequency.
1 0 -1 -2 -3 -4 -5 -6 -7 0
Active Supply Current vs.
100
10
1 -40 -25 -10 5 20 35 50 65 80 95 11 12 05 Temperature (C)
RS & SHDN Sink Current (mA)
VDD = 5.5V
2
4
6
RS & SHDN Pin Voltage (V)
FIGURE 2-9: Temperature.
Static Current vs.
FIGURE 2-12: Reset & Shutdown Pins Current vs. Voltage.
DS11195C-page 8
2003 Microchip Technology Inc.
MCP41XXX/42XXX
Note: Unless otherwise indicated, curve represents 10 k, 50 k and 100 k devices, VDD = 5V, VSS = 0V, TA = +25C, VB = 0V.
180 Number of Occurrences 160 140 120 100 80 60 40 20 0 47 48 49 50 51 52 53 54 55 56 57 58 59 Wiper Resistance ()
MCP41010,MCP42010 Code = 00h, Sample Size = 400
CL = 27 pF VOUT FFh
00h CS
FIGURE 2-13: 10 k Device Wiper Resistance Histogram.
140 Number of Occurrences 120 100 80 60 40 20 0 115 117 119 121 123 125 127 129 131 133 Wiper Resistance ()
FIGURE 2-16:
Full-Scale Settling Time.
MCP41050, MCP41100, MCP42050, MCP42100 Code = 00h, Sample Size = 796
CL = 27 pF Code = 80h VOUT
CS
FIGURE 2-14: 50 k, 100 k Device Wiper Resistance Histogram.
FIGURE 2-17: Time.
6
Digital Feed through vs.
CL = 17 pF
0 -6 -12 Gain (dB) -18 -24 -30 -36 -42 -48 -54 -60
Code = FFh Code = 80h Code = 40h Code = 20h Code = 10h Code = 08h Code = 04h Code = 02h Code = 01h
VOUT
Code = 7Fh
Code = 80h
CS
CL = 30pF, Refer to Figure 2-29 MCP41010, MCP42010 (10k potentiometers)
100
1k
10k 100k Frequency (Hz)
1M
10M
FIGURE 2-15:
One Position Settling Time.
FIGURE 2-18: Gain vs. Frequency for 10 k Potentiometer.
2003 Microchip Technology Inc.
DS11195C-page 9
MCP41XXX/42XXX
Note: Unless otherwise indicated, curve represents 10 k, 50 k and 100 k devices, VDD = 5V, VSS = 0V, TA = +25C, VB = 0V.
6 0 -6 -12 Gain (dB) -18 -24 -30 -36 -42 -48 -54 -60
Code = 01h
Code = FFh Code = 80h Code = 40h
40 35 30 PSRR (dB) 25 20 15 10
100 k Potentiometer 10 k Potentiometer
Code = 20h Code = 10h Code = 08h Code = 04h Code = 02h
VDD = 4.5V to 5.5V, Code = 80h, CL = 27 pF, VA = 4V Refer to Figure 2-28
50 k Potentiometer
CL = 30pF, Refer to Figure 2-29 MCP41050, MCP42050 (50k potentiometers)
5
1M 10M
100
1k
10k 100k Frequency (Hz)
0
1k
10k
100k Frequency (Hz)
1M
10M
FIGURE 2-19: Gain vs. Frequency for 50k Potentiometer.
6 0 -6 -12 Gain (dB) -18 -24 -30 -36 -42 -48 -54 -60
CL = 30pF, Refer to Figure 2-29 MCP41100, MCP42100 (100k potentiometers)
FIGURE 2-22: Power Supply Rejection Ratio vs. Frequency.
700 Wiper Resistance () 600 500 400 300 200 100 0 0 1 2 3 4 5
VDD = 5V VDD = 2.7V
Code = FFh Code = 80h Code = 40h Code = 20h Code = 10h Code = 08h Code = 04h Code = 02h Code = 01h
MCP41010, MCP42010 Iw = 1 mA, Code = 00h, Refer to Figure 2-27
100
1k
10k Frequency (Hz)
100k
1M
Terminal B Voltage (V)
FIGURE 2-20: Gain vs. Frequency for 100k Potentiometer.
0
FIGURE 2-23: Voltage.
450 400 Wiper Resistance () 350 300 250 200 150 100 50 0 10M 0 1
10 k Wiper Resistance vs.
-6 Gain (dB) -12 -18 -24
50 k 145 kHz 279 kHz 10 k 1.06 MHz
Code = 00h Refer to Figure 2-27
VDD = 2.7V
VDD = 5V
-30 -36 1k
CL = 30 pF, Code = 80h Refer to Figure 2-29
100 k
10k
100k Frequency (Hz)
1M
2
3
4
5
Terminal B Voltage (V)
FIGURE 2-21:
-3 dB Bandwidths.
FIGURE 2-24: 50 k & 100 k Wiper Resistance vs. Voltage.
DS11195C-page 10
2003 Microchip Technology Inc.
MCP41XXX/42XXX
2.1 Parametric Test Circuits
V+ = VDD 1LSB = V+/256 W + VMEAS* V+ VA
V+
A B DUT
VDD A B DUT W +V MEAS* -
*Assume infinite input impedance
FIGURE 2-25: Potentiometer Divider NonLinearity Error Test Circuit (DNL, INL).
No Connection A B DUT W + - VMEAS*
V+ = VDD 10% PSRR (dB) = 20LOG ( PSS (%/%) = VDD VMEAS
VDD ) VMEAS
*Assume infinite input impedance IW
FIGURE 2-28: Power Supply Sensitivity Test Circuit (PSS, PSRR).
A VIN
+5V W + VOUT
~
DUT B
*Assume infinite input impedance
OFFSET GND
FIGURE 2-26: Resistor Position NonLinearity Error Test Circuit (Rheostat operation DNL, INL).
Rsw = 0.1V Isw Code = 00h ISW + VSS = 0 to VDD VIN 0.1V
2.5V DC
DUT
A W B
FIGURE 2-29: Circuit.
Gain vs. Frequency Test
A
DUT
B +5V VOUT MCP601
~
+ 2.5V DC Offset
FIGURE 2-27: Circuit.
Wiper Resistance Test
FIGURE 2-30:
Capacitance Test Circuit.
2003 Microchip Technology Inc.
DS11195C-page 11
MCP41XXX/42XXX
3.0
3.1
PIN DESCRIPTIONS
PA0, PA1
3.9
Shutdown (SHDN) (MCP42XXX devices only)
Potentiometer Terminal A Connection.
3.2
PB0, PB1
Potentiometer Terminal B Connection.
3.3
PW0, PW1
Potentiometer Wiper Connection.
The Shutdown pin has a Schmitt Trigger input. Pulling this pin low will put the device in a power-saving mode where A terminal is opened and the B and W terminals are connected for all potentiometers. This pin should not be toggled low when the CS pin is low. In order to minimize power consumption, this pin has an active pull-up circuit. The performance of this circuit is shown in Figure 2-12. This pin will draw negligible current at logic level `0' and logic level `1'. Do not leave this pin floating.
3.4
Chip Select (CS)
TABLE 3-1:
Pin # Name 1 2 3 4 5 6 7 8 CS SCK SI VSS PA0 PW0 PB0 VDD
MCP41XXX Pins
Function Chip Select Serial Clock Serial Data Input Ground Terminal A Connection For Pot 0 Wiper Connection For Pot 0 Terminal B Connection For Pot 0 Power
This is the SPI port chip select pin and is used to execute a new command after it has been loaded into the shift register. This pin has a Schmitt Trigger input.
3.5
Serial Clock (SCK)
This is the SPI port clock pin and is used to clock-in new register data. Data is clocked into the SI pin on the rising edge of the clock and out the SO pin on the falling edge of the clock. This pin is gated to the CS pin (i.e., the device will not draw any more current if the SCK pin is toggling when the CS pin is high). This pin has a Schmitt Trigger input.
3.6
Serial Data Input (SI)
TABLE 3-2:
Pin # Name 1 2 3 4 5 6 7 8 9 10 11 12 13 14 CS SCK SI VSS PB1 PW1 PA1 PA0 PW0 PB0 RS SO VDD
MCP42XXX Pins
Function Chip Select Serial Clock Serial Data Input Ground Terminal B Connection For Pot 1 Wiper Connection For Pot 1 Terminal A Connection For Pot 1 Terminal A Connection For Pot 0 Wiper Connection For Pot 0 Terminal B Connection For Pot 0 Reset Input Data Out for Daisy-Chaining Power
This is the SPI port serial data input pin. The command and data bytes are clocked into the shift register using this pin. This pin is gated to the CS pin (i.e., the device will not draw any more current if the SI pin is toggling when the CS pin is high). This pin has a Schmitt Trigger input.
3.7
Serial Data Output (SO) (MCP42XXX devices only)
This is the SPI port serial data output pin used for daisy-chaining more than one device. Data is clocked out of the SO pin on the falling edge of clock. This is a push-pull output and does not go to a high-impedance state when CS is high. It will drive a logic-low when CS is high.
3.8
Reset (RS) (MCP42XXX devices only)
SHDN Shutdown Input
The Reset pin will set all potentiometers to mid-scale (Code 80h) if this pin is brought low for at least 150 ns. This pin should not be toggled low when the CS pin is low. It is possible to toggle this pin when the SHDN pin is low. In order to minimize power consumption, this pin has an active pull-up circuit. The performance of this circuit is shown in Figure 2-12. This pin will draw negligible current at logic level `0' and logic level `1'. Do not leave this pin floating.
DS11195C-page 12
2003 Microchip Technology Inc.
MCP41XXX/42XXX
4.0 APPLICATIONS INFORMATION
power-up, all data registers will automatically be loaded with the mid-scale value (80h). The serial interface provides the means for loading data into the shift register, which is then transferred to the data registers. The serial interface also provides the means to place individual potentiometers in the shutdown mode for maximum power savings. The SHDN pin can also be used to put all potentiometers in shutdown mode and the RS pin is provided to set all potentiometers to mid-scale (80h). The MCP41XXX/42XXX devices are 256 position single and dual digital potentiometers that can be used in place of standard mechanical pots. Resistance values of 10 k, 50 k and 100 k are available. As shown in Figure 4-1, each potentiometer is made up of a variable resistor and an 8-bit (256 position) data register that determines the wiper position. There is a nominal wiper resistance of 52 for the 10 k version, 125 for the 50 k and 100 k versions. For the dual devices, the channel-to-channel matching variation is less than 1%. The resistance between the wiper and either of the resistor endpoints varies linearly according to the value stored in the data register. Code 00h effectively connects the wiper to the B terminal. At PA0 PW0
PB0 PA1
PW1
PB1
RDAC1 Data Register 0 D7 RS D0
RDAC2 Data Register 1 D7 D0
Decode Logic CS
D7
D0
16-bit Shift Register
SCK
SI
SO
SHDN
FIGURE 4-1: Block diagram showing the MCP42XXX dual digital potentiometer. Data register 0 and data register 1 are 8-bit registers allowing 256 positions for each wiper. Standard SPI pins are used with the addition of the Shutdown (SHDN) and Reset (RS) pins. As shown, reset affects the data register and wipers, bringing them to mid-scale. Shutdown disconnects the A terminal and connects the wiper to B, without changing the state of the data registers.
VDD 0.1 uF VDD 0.1 uF B W A To Application Circuit When laying out the circuit for your digital potentiometer, bypass capacitors should be used. These capacitors should be placed as close as possible to the device pin. A bypass capacitor value of 0.1 F is recommended. Digital and analog traces should be separated as much as possible on the board, with no traces running underneath the device or the bypass capacitor. Extra precautions should be taken to keep traces with high-frequency signals (such as clock lines) as far as possible from analog traces. Use of an analog ground plane is recommended in order to keep the ground potential the same for all devices on the board.
C Data Lines
2003 Microchip Technology Inc.
MCP4XXXX
DS11195C-page 13
MCP41XXX/42XXX
4.1 Modes of Operation
4.1.2 POTENTIOMETER MODE
Digital potentiometer applications can be divided into two categories: rheostat mode and potentiometer, or voltage divider, mode. In the potentiometer mode, all three terminals of the device are tied to different nodes in the circuit. This allows the potentiometer to output a voltage proportional to the input voltage. This mode is sometimes called voltage divider mode. The potentiometer is used to provide a variable voltage by adjusting the wiper position between the two endpoints as shown in Figure 4-3. Note that reversing the polarity of the A and B terminals will not affect operation. V1 A W W B MCP4XXXX Resistor B MCP4XXXX V2
4.1.1
RHEOSTAT MODE
In the rheostat mode, the potentiometer is used as a two-terminal resistive element. The unused terminal should be tied to the wiper, as shown in Figure 4-2. Note that reversing the polarity of the A and B terminals will not affect operation.
A
FIGURE 4-2: Two-terminal or rheostat configuration for the digital potentiometer. Acting as a resistive element in the circuit, resistance is controlled by changing the wiper setting.
Using the device in this mode allows control of the total resistance between the two nodes. The total measured resistance would be the least at code 00h, where the wiper is tied to the B terminal. The resistance at this code is equal to the wiper resistance, typically 52 for the 10 k MCP4X010 devices, 125 for the 50 k (MCP4X050), and 100 k (MCP4X100) devices. For the 10 k device, the LSB size would be 39.0625 (assuming 10 k total resistance). The resistance would then increase with this LSB size until the total measured resistance at code FFh would be 9985.94. The wiper will never directly connect to the A terminal of the resistor stack. In the 00h state, the total resistance is the wiper resistance. To avoid damage to the internal wiper circuitry in this configuration, care should be taken to ensure the current flow never exceeds 1 mA. For dual devices, the variation of channel-to-channel matching of the total resistance from A to B is less than 1%. The device-to-device matching, however, can vary up to 30%. In the rheostat mode, the resistance has a positive temperature coefficient. The change in wiperto-end terminal resistance over temperature is shown in Figure 2-8. The most variation over temperature will occur in the first 6% of codes (code 00h to 0Fh) due to the wiper resistance coefficient affecting the total resistance. The remaining codes are dominated by the total resistance tempco RAB, typically 800 ppm/C.
FIGURE 4-3: divider mode.
Three terminal or voltage
In this configuration, the ratio of the internal resistance defines the temperature coefficient of the device. The resistor matching of the RWB resistor to the RAB resistor performs with a typical temperature coefficient of 1 ppm/C (measured at code 80h). At lower codes, the wiper resistance temperature coefficient will dominate. Figure 2-3 shows the effect of the wiper. Above the lower codes, this figure shows that 70% of the states will typically have a temperature coefficient of less than 5 ppm/C. 30% of the states will typically have a ppm/C of less than 1.
DS11195C-page 14
2003 Microchip Technology Inc.
MCP41XXX/42XXX
4.2
4.2.1
Typical Applications
PROGRAMMABLE SINGLE-ENDED AMPLIFIERS
Potentiometers are often used to adjust system reference levels or gain. Programmable gain circuits using digital potentiometers can be realized in a number of different ways. An example of a single-supply, inverting gain amplifier is shown in Figure 4-4. Due to the high input impedance of the amplifier, the wiper resistance is not included in the transfer function. For a single-supply, non-inverting gain configuration, the circuit in Figure 4-5 can be used.
.
MCP41010
VIN A W -IN VREF
-
B VDD
MCP606
+IN + VSS
VOUT
In order for these circuits to work properly, care must be taken in a few areas. For linear operation, the analog input and output signals must be in the range of VSS to VDD for the potentiometer and input and output rails of the op-amp. The circuit in Figure 4-4 requires a virtual ground or reference input to the non-inverting input of the amplifier. Refer to Application Note 682, "Using Single-Supply Operational Amplifiers in Embedded Systems" (DS00682), for more details. At power-up or reset (RS), the resistance is set to mid-scale, with RA and RB matching. Based on the transfer function for the circuit, the gain is -1 V/V. As the code is increased and the wiper moves towards the A terminal, the gain increases. Conversely, when the wiper is moved towards the B terminal, the gain decreases. Figure 4-6 shows this relationship. Notice the pseudo-logarithmic gain around decimal code 128. As the wiper approaches either terminal, the step size in the gain calculation increases dramatically. Due to the mismatched ratio of RA and RB at the extreme high and low codes, small increments in wiper position can dramatically affect the gain. As shown in Figure 4-3, recommended gains lie between 0.1 and 10 V/V.
10 Absolute Gain (V/V)
V OUT Where:
RB RB = - V IN ------ + V REF 1 + ------ R - R
A A
R AB ( 256 - D n ) R A = -------------------------------------256
R AB D n R B = ----------------256
1
R AB = Total Resistance of pot D n = Wiper setting forD n = 0 to 255
0.1 0 64 128 192 256 Decimal code (0-255)
FIGURE 4-4: Single-supply, programmable, inverting gain amplifier using a digital potentiometer.
VDD VIN +IN
+
FIGURE 4-6: Gain vs. Code for inverting and differential amplifier circuits. 4.2.2 PROGRAMMABLE DIFFERENTIAL AMPLIFIER
MCP606
-IN RA W RB VSS
VOUT
MCP41010
Where: R AB ( 256 - D n ) R A = -------------------------------------256
RB V OUT = V IN 1 + ------ R
A
R AB D n R B = ----------------256
An example of a differential input amplifier using digital potentiometers is shown in Figure 4-7. For the transfer function to hold, both pots must be programmed to the same code. The resistor-matching from channel-tochannel within a dual device can be used as an advantage in this circuit. This circuit will also show stable operation over temperature due to the low potentiometer temperature coefficient. Figure 4-6 also shows the relationship between gain and code for this circuit. As the wiper approaches either terminal, the step size in the gain calculation increases dramatically. This circuit is recommended for gains between 0.1 and 10 V/V.
R AB = Total Resistance of pot D n = Wiper setting forD n = 0 to 255
FIGURE 4-5: Single-supply, programmable, non-inverting gain amplifier.
2003 Microchip Technology Inc. DS11195C-page 15
MCP41XXX/42XXX
VB (SIG -) VA 1/2 MCP42010 (SIG +) A B -IN +IN 1/2 MCP42010 A B + VDD VOUT
4.3
Calculating Resistances
MCP601 VSS
When programming the digital potentiometer settings, the following equations can be used to calculate the resistances. Programming code 00h effectively brings the wiper to the B terminal, leaving only the wiper resistance. Programming higher codes will bring the wiper closer to the A terminal of the potentiometer. The equations in Figure 4-9 can be used to calculate the terminal resistances. Figure 4-10 shows an example calculation using a 10 k potentiometer. PA PW PB ( R AB ) ( 256 - D n ) R WA ( D n ) = ------------------------------------------- + R W 256 ( R AB ) ( D n ) R WB ( D n ) = --------------------------- + R W 256
Where: PA is the A terminal PB is the B terminal PW is the wiper terminal RWA is resistance between Terminal A and wiper RWB is resistance between Terminal B and Wiper RAB is overall resistance for pot (10 k, 50 k or 100 k) RW is wiper resistance Dn is 8-bit value in data register for pot number n
Where: RA
VREF
RB V OUT = ( V A - V B ) -----RA R AB D n = ----------------256
R AB ( 256 - D n ) = -------------------------------------256
RB
R AB = Total Resistance of pot D n = Wiper setting forDn = 0 to 255 NOTE: Potentiometer values must be equal
FIGURE 4-7: Single Supply programmable differential amplifier using digital potentiometers. 4.2.3 PROGRAMMABLE OFFSET TRIM
For applications requiring only a programmable voltage reference, the circuit in Figure 4-8 can be used. This circuit shows the device used in the potentiometer mode along with two resistors and a buffered output. This creates a circuit with a linear relationship between voltage-out and programmed code. Resistors R1 and R2 can be used to increase or decrease the output voltage step size. The potentiometer in this mode is stable over temperature. The operation of this circuit over temperature is shown in Figure 2-3. The worst performance over temperature will occur at the lower codes due to the dominating wiper resistance. R1 and R2 can also be used to affect the boundary voltages, thereby eliminating the use of these lower codes. VDD R1
FIGURE 4-9: Potentiometer resistances are a function of code. It should be noted that, when using these equations for most feedback amplifier circuits (see Figure 4-4 and Figure 4-5), the wiper resistance can be omitted due to the high impedance input of the amplifier.
PA 10 k PW PB ( R AB ) ( 256 - D n ) R WA ( D n ) = ------------------------------------------- + R W 256 ( 10k ) ( 256 - 192 ) R WA ( C0h ) = -------------------------------------------------- + 52 256 R WA ( C0h ) = 2552 ( R AB ) ( D n ) R WB ( D n ) = --------------------------- + R W 256 ( 10k ) ( 192 ) R WB ( C0h ) = ---------------------------------- + 52 256 R WB ( C0h ) = 7552 Note: All values shown are typical and actual results will vary. Example: R = 10 k Code = C0h = 192d
VDD MCP606 OUT +IN + VSS 0.1 uF -IN
-
MCP41010
A B
R2
VSS
FIGURE 4-8: By changing the values of R1 and R2, the voltage output resolution of this programmable voltage reference circuit is affected.
FIGURE 4-10: calculations.
Example Resistance
DS11195C-page 16
2003 Microchip Technology Inc.
MCP41XXX/42XXX
5.0 SERIAL INTERFACE
5.3 Using The Shutdown Command
Communications from the controller to the MCP41XXX/42XXX digital potentiometers is accomplished using the SPI serial interface. This interface allows three commands: 1. 2. 3. Write a new value to the potentiometer data register(s). Cause a channel to enter low power shutdown mode. NOP (No Operation) command. The shutdown command allows the user to put the application circuit into a power-saving mode. In this mode, the A terminal is open-circuited and the B and W terminals are shorted together. The command select bits C1, C0 are set to 1,0. The potentiometer selection bits P1 and P0 allow each potentiometer to be shutdown independently. If either P1 or P0 are high, the respective potentiometer will enter shutdown mode. A `0' for P1 or P0 will have no effect. The eight data bits following the command byte still need to be transmitted for the shutdown command, but they are `don't care' bits. See Figure 5-2 for command format summary. Once a particular potentiometer has entered the shutdown mode, it will remain in this mode until: * A new value is written to the potentiometer data register, provided that the SHDN pin is high. The device will remain in the shutdown mode until the rising edge of the CS is detected, at which time the device will come out of shutdown mode and the new value will be written to the data register(s). If the SHDN pin is low when the new value is received, the registers will still be set to the new value, but the device will remain in shutdown mode. This scenario assumes that a valid command was received. If an invalid command was received, the command will be ignored and the device will remain in the shutdown mode. It is also possible to use the hardware shutdown pin and reset pin to remove a device from software shutdown. To do this, a low pulse on the chip select line must first be sent. For multiple devices, sharing a single SHDN or RESET line allows you to pick an individual device on that chain to remove from software shutdown mode. See Figure 1-3 for timing. With a preceding chip select pulse, either of these situations will also remove a device from software shutdown: * A falling edge is seen on the RS pin and held low for at least 150 ns, provided that the SHDN pin is high. If the SHDN pin is low, the registers will still be set to mid-scale, but the device will remain in shutdown mode. This condition assumes that CS is high, as bringing the RS pin low while CS is low is an invalid state and results are indeterminate. * A rising edge on the SHDN pin is seen after being low for at least 100 ns, provided that the CS pin is high. Toggling the SHDN pin low while CS is low is an invalid state and results are indeterminate. * The device is powered-down and back up. Note: The hardware SHDN pin will always put the device in shutdown regardless of whether a potentiometer has already been put in the shutdown mode using the software command.
Executing any command is accomplished by setting CS low and then clocking-in a command byte followed by a data byte into the 16-bit shift register. The command is executed when CS is raised. Data is clockedin on the rising edge of clock and out the SO pin on the falling edge of the clock (see Figure 5-1). The device will track the number of clocks (rising edges) while CS is low and will abort all commands if the number of clocks is not a multiple of 16.
5.1
Command Byte
The first byte sent is always the command byte, followed by the data byte. The command byte contains two command select bits and two potentiometer select bits. Unused bits are `don't care' bits. The command select bits are summarized in Figure 5-2. The command select bits C1 and C0 (bits 4:5) of the command byte determine which command will be executed. If the command bits are both 0's or 1's, then a NOP command will be executed once all 16 bits have been loaded. This command is useful when using the daisychain configuration. When the command bits are 0,1, a write command will be executed with the 8 bits sent in the data byte. The data will be written to the potentiometer(s) determined by the potentiometer select bits. If the command bits are 1,0, then a shutdown command will be executed on the potentiometers determined by the potentiometer select bits. For the MCP42XXX devices, the potentiometer select bits P1 and P0 (bits 0:1) determine which potentiometers are to be acted upon by the command. A corresponding `1' in the position signifies that the command for that potentiometer will get executed, while a `0' signifies that the command will not effect that potentiometer (see Figure 5-2).
5.2
Writing Data Into Data Registers
When new data is written into one or more of the potentiometer data registers, the write command is followed by the data byte for the new value. The command select bits C1, C0 are set to 0,1. The potentiometer selection bits P1 and P0 allow new values to be written to potentiometer 0, potentiometer 1 (or both) with a single command. A `1' for either P1 or P0 will cause the data to be written to the respective data register and a `0' for P1 or P0 will cause no change. See Figure 5-2 for the command format summary.
2003 Microchip Technology Inc.
DS11195C-page 17
MCP41XXX/42XXX
Data is always latched in on the rising edge of SCK. CS 1 SCK COMMAND Byte
Don't Care Bits Command Bits Don't Care Bits Channel Select Bits
Data is always clocked out of the SO pin after the falling edge of SCK.
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16 Data Byte New Register Data
Data Registers are loaded on rising edge of CS. Shift register is loaded with zeros at this time.
SI
X
X
C1 C0 X
X P1* P0 D7 D6 D5 D4 D3 D2 D1 D0 SO pin will always drive low when CS goes high.
SO
First 16 bits shifted out will always be zeros
X
There must always be multiples of 16 clocks while CS is low or commands will abort. The serial data out pin (SO) is only available on the MCP42XXX device. * P1 is a `don't care' bit for the MCP41XXX.
FIGURE 5-1:
Timing Diagram for Writing Instructions or Data to a Digital Potentiometer.
COMMAND BYTE X X C1 C0 X Command Selection Bits X P1* P0 Potentiometer Selection Bits
C1 C0 0 0 0 1
Command None Write Data
Command Summary No Command will be executed. Write the data contained in Data Byte to the potentiometer(s) determined by the potentiometer selection bits. Potentiometer(s) determined by potentiometer selection bits will enter Shutdown Mode. Data bits for this command are `don't cares'. No Command will be executed.
P1* P0 0 0 1 1 0 1 0 1
Potentiometer Selections Dummy Code: Neither Potentiometer affected. Command executed on Potentiometer 0. Command executed on Potentiometer 1. Command executed on both Potentiometers.
1
0
Shutdown
1
1
None
FIGURE 5-2:
Command Byte Format.
DS11195C-page 18
2003 Microchip Technology Inc.
MCP41XXX/42XXX
5.4 Daisy-Chain Configuration
Multiple MCP42XXX devices can be connected in a daisy-chain configuration, as shown in Figure 5-4, by connecting the SO pin from one device to the SI pin on the next device. The data on the SO pin is the output of the 16-bit shift register. The daisy-chain configuration allows the system designer to communicate with several devices without using a separate CS line for each device. The example shows a daisy-chain configuration with three devices, although any number of devices (with or without the same resistor values) can be configured this way. While it is not possible to use a MCP41XXX at the beginning or middle of a daisy-chain (because it does not provide the serial data out (SO) pin), it is possible to use the device at the end of a chain. As shown in the timing diagram in Figure 5-3, data will be clocked-out of the SO pin on the falling edge of the clock. The SO pin has a CMOS push-pull output and will drive low when CS goes high. SO will not go to a high-impedance state when CS is held high. When using the daisy-chain configuration, the maximum clock speed possible is reduced to ~5.8 MHz, because of the propagation delay of the data coming out of the SO pin. When using the daisy-chain configuration, keep in mind that the shift register of each device is automatically loaded with zeros whenever a command is executed (CS = high). Because of this, the first 16 bits that come out of the SO pin once the CS line goes low will always be zeros. This means that when the first command is being loaded into a device, it will always shift a NOP command into the next device on the chain because the command bits (and all the other bits) will be zeros. This feature makes it necessary only to send command and data bytes to the device farthest down the chain that needs a new command. For example, if there were three devices on the chain and it was desired to send a command to the device in the middle, only 32 bytes of data need to be transmitted. The last device on the chain will have a NOP loaded from the previous device so no registers will be affected when the CS pin is raised to execute the command. The user must always ensure that multiples of 16 clocks are always provided (while CS is low), as all commands will abort if the number of clocks provided is not a multiple of 16.
CS 1 2 3 4 5 6 7 8 9 10111213141516 SCK Command Byte for Device 3 SI Data Byte for Device 3 Command Byte for Device 2 Data Byte for Device 2 1 2 3 4 5 6 7 8 9 10 111213141516
Data Registers for all devices are loaded on Rising Edge of CS
1 2 3 4 5 6 7 8 9 10 111213141516
Command Byte for Device 1
Data Byte for Device 1
X XCCXXP PDDDDDDDD
X XCCXXP PDDDDDDDD Command and Data for Device 3 start shifting out after the first 16 clocks X XCCXXP PDDDDDDDD
X XCCXXP PDDDDDDDD Command and Data for Device 2 start shifting out after the first 32 clocks X XCCXXP PDDDDDDDD
SO
First 16 bits shifted out will always be zeros
There must always be multiples of 16 clocks while CS is low or commands will abort. The serial data out pin (SO) is only available on the MCP42XXX device.
FIGURE 5-3:
Timing Diagram for Daisy-Chain Configuration.
2003 Microchip Technology Inc.
DS11195C-page 19
MCP41XXX/42XXX
CS SCK SO Microcontroller CS SCK SI SO Device 1 EXAMPLE: If you want to load the following command/data into each part in the chain. Device 1 XX10XX11 11001100 Device 2 XX01XX10 11110000 CS SCK SI SO CS SCK SI Device 3*
Device 2
Device 3 XX10XX00 10101010
After 16 clocks, Device 2 and Device 3 will both have all zeros clocked in from the previous part's shift register.
Start by setting CS low and clocking in the command and data that will end up in Device 3 (16 clocks).
Device 1 XX10XX00 10101010
Device 2 00000000 00000000
Device 3 00000000 00000000
Clock-In the command and data for Device 2 (16 more clocks). The data that was previously loaded gets shifted to the next device on the chain.
After 32 clocks, Device 2 has the data previously loaded into Device 1 and Device 3 gets 16 more zeros.
Device 1 XX01XX10 11110000
Device 2 XX10XX00 10101010
Device 3 00000000 00000000
Clock-In the data for Device 1 (16 more clocks). The data that was previously loaded into Device 1 gets shifted into Device 2 and Device 3 contains the first byte loaded. Raise the CS line to execute the commands for all 3 devices at the same time.
After 48 clocks, all 3 devices have the proper command/ data loaded into their shift registers.
Device 1 XX10XX11 11001100
Device 2 XX01XX10 11110000
Device 3 XX10XX00 10101010
* Last device on a daisy-chain may be a single channel MCP41XXX device.
FIGURE 5-4:
Daisy-Chain Configuration.
DS11195C-page 20
2003 Microchip Technology Inc.
MCP41XXX/42XXX
5.5 Reset (RS) Pin Operation
TABLE 5-1:
SCK X CS O RS H
The Reset pin (RS) will automatically set all potentiometer data latches to mid-scale (Code 80h) when pulled low (provided that the pin is held low at least 150 ns and CS is high). The reset will execute regardless of the position of the SCK, SHDN and SI pins. It is possible to toggle RS low and back high while SHDN is low. In this case, the potentiometer registers will reset to mid-scale, but the potentiometer will remain in shutdown mode until the SHDN pin is raised. Note: Bringing the RS pin low while the CS pin is low constitutes an invalid operating state and will result in indeterminate results when RS and/or CS are brought high.
TRUTH TABLE FOR LOGIC INPUTS
SHDN H Action Communication is initiated with device. Device comes out of standby mode. No action. Device is waiting for data to be clocked into shift register or CS to go high to execute command. Shift one bit into shift register. The shift register can be loaded while the SHDN pin is low. Shift one bit out of shift register on the SO pin. The SO pin is active while the SHDN pin is low. Based on command bits, either load data from shift register into data latches or execute shutdown command. Neither command executed unless multiples of 16 clocks have been entered while CS is low. SO pin goes to a logic low. Static Operation. All data registers set and latched to code 80h. All data registers set and latched to code 80h. Device is in hardware shutdown mode and will remain in this mode. All potentiometers put into hardware shutdown mode; terminal A is open and W is shorted to B. All potentiometers exit hardware shutdown mode. Potentiometers will also exit software shutdown mode if this rising edge occurs after a low pulse on CS. Contents of data latches are restored.
L
L
H
H
|
L
H
X
O
L
H
X
5.6
Shutdown (SHDN) Pin Operation
X | H H
When held low, the shutdown pin causes the application circuit to go into a power-saving mode by open-circuiting the A terminal and shorting the B and W terminals for all potentiometers. Data register contents are not affected by entering shutdown mode (i.e., when the SHDN pin is raised, the data register contents are the same as before the shutdown mode was entered). While in shutdown mode, it is still possible to clock in new values for the data registers, as well as toggling the RS pin to cause all data registers to go to mid-scale. The new values will take affect when the SHDN pin is raised. If the device is powered-up with the SHDN pin held low, it will power-up in the shutdown mode with the data registers set to mid-scale. Note: Bringing the SHDN pin low while the CS pin is low constitutes an invalid operating state and will result in indeterminate results when SHDN and/or CS are brought high.
X X X
H H H
H O O
H H L
X
H
H
O
X
H
H
|
5.7
Power-up Considerations
When the device is powered on, the data registers will be set to mid-scale (80h). A power-on reset circuit is utilized to ensure that the device powers up in this known state.
2003 Microchip Technology Inc.
DS11195C-page 21
MCP41XXX/42XXX
5.8 Using the MCP41XXX/42XXX in SPI Mode 1,1
It is possible to operate the devices in SPI modes 0,0 and 1,1. The only difference between these two modes is that, when using mode 1,1, the clock idles in the high state, while in mode 0,0, the clock idles in the low state. In both modes, data is clocked into the devices on the rising edge of SCK and data is clocked out the SO pin once the falling edge of SCK. Operations using mode 0,0 are shown in Figure 5-1. The example in Figure 5-5 shows mode 1,1.
Data is always latched in on the rising edge of SCK. CS 1 SCK COMMAND BYTE Don't Care Bits SI X X Command Bits C1 C0 Don't Care Bits X X Channel Select Bits P1* P0 D7 D6 DATA BYTE New Register Data D5 D4 D3 D2 D1 D0 2 3 4 5 6 7 8 9 10 Data is always clocked out the SO pin after the falling edge of SCK.
Data Registers are loaded on rising edge of CS. Shift register is loaded with zeros at this time.
11
12
13
14
15
16
SO
First 16 bits Shifted out will always be zeros
There must always be multiples of 16 clocks while CS is low or commands will abort.
X
SO pin will always drive low when CS goes high.
The serial data out pin (SO) is only available on the MCP42XXX device.
FIGURE 5-5:
Timing Diagram for SPI Mode 1,1 Operation.
DS11195C-page 22
2003 Microchip Technology Inc.
MCP41XXX/42XXX
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
8-Lead PDIP (300 mil) Example:
XXXXXXXX XXXXXNNN YYWW
MCP41010 I/P256 0313
8-Lead SOIC (150 mil)
Example:
XXXXXXXX XXXXYYWW NNN
MCP41050 I/SN0313 256
14-Lead PDIP (300 mil)
Example:
XXXXXXXXXXXXXX XXXXXXXXXXXXXX YYWWNNN
MCP42010 I/P 0313256
14-Lead SOIC (150 mil)
Example:
XXXXXXXXXXX XXXXXXXXXXX YYWWNNN
42050ISL XXXXXXXXXXX 0313256
14-Lead TSSOP (4.4mm) *
Example:
XXXXXXXX YYWW NNN
42100I 0313 256
Legend: XX...X YY WW NNN Note:
Customer specific information* Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code
In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information.
*
Standard marking consists of Microchip part number, year code, week code, facility code, mask rev#, and assembly code.
2003 Microchip Technology Inc.
DS11195C-page 23
MCP41XXX/42XXX
8-Lead Plastic Dual In-line (P) - 300 mil (PDIP)
E1
D 2 n 1 E
A
A2
c
L A1
eB
B1 p B
Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic
Units Dimension Limits n p A A2 A1 E E1 D L c B1 B eB
MIN
INCHES* NOM 8 .100 .155 .130 .313 .250 .373 .130 .012 .058 .018 .370 10 10
MAX
MIN
.140 .115 .015 .300 .240 .360 .125 .008 .045 .014 .310 5 5
.170 .145 .325 .260 .385 .135 .015 .070 .022 .430 15 15
MILLIMETERS NOM 8 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 9.14 9.46 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10
MAX
4.32 3.68 8.26 6.60 9.78 3.43 0.38 1.78 0.56 10.92 15 15
Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018
DS11195C-page 24
2003 Microchip Technology Inc.
MCP41XXX/42XXX
8-Lead Plastic Small Outline (SN) - Narrow, 150 mil (SOIC)
E E1
p D 2 B n 1
h 45
c A
A2
L A1
Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic
Units Dimension Limits n p A A2 A1 E E1 D h L c B
MIN
.053 .052 .004 .228 .146 .189 .010 .019 0 .008 .013 0 0
INCHES* NOM 8 .050 .061 .056 .007 .237 .154 .193 .015 .025 4 .009 .017 12 12
MAX
MIN
.069 .061 .010 .244 .157 .197 .020 .030 8 .010 .020 15 15
MILLIMETERS NOM 8 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 6.02 3.71 3.91 4.80 4.90 0.25 0.38 0.48 0.62 0 4 0.20 0.23 0.33 0.42 0 12 0 12
MAX
1.75 1.55 0.25 6.20 3.99 5.00 0.51 0.76 8 0.25 0.51 15 15
Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057
2003 Microchip Technology Inc.
DS11195C-page 25
MCP41XXX/42XXX
14-Lead Plastic Dual In-line (P) - 300 mil (PDIP)
E1
D
2 n 1
E A A2
c A1 eB B1 B p
L
Number of Pins Pitch Top to Seating Plane A .140 .170 Molded Package Thickness A2 .115 .145 Base to Seating Plane A1 .015 Shoulder to Shoulder Width E .300 .313 .325 Molded Package Width E1 .240 .250 .260 Overall Length D .740 .750 .760 Tip to Seating Plane L .125 .130 .135 c Lead Thickness .008 .012 .015 Upper Lead Width B1 .045 .058 .070 Lower Lead Width B .014 .018 .022 Overall Row Spacing eB .310 .370 .430 Mold Draft Angle Top 5 10 15 Mold Draft Angle Bottom 5 10 15 * Controlling Parameter Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-005
Units Dimension Limits n p
MIN
INCHES* NOM 14 .100 .155 .130
MAX
MIN
MILLIMETERS NOM 14 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 18.80 19.05 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10
MAX
4.32 3.68 8.26 6.60 19.30 3.43 0.38 1.78 0.56 10.92 15 15
DS11195C-page 26
2003 Microchip Technology Inc.
MCP41XXX/42XXX
14-Lead Plastic Small Outline (SL) - Narrow, 150 mil (SOIC)
E E1
p
D
2 B n 1 h 45 c A A2
L Units Dimension Limits n p A A2 A1 E E1 D h L c B INCHES* NOM 14 .050 .061 .056 .007 .236 .154 .342 .015 .033 4 .009 .017 12 12 MILLIMETERS NOM 14 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 5.99 3.81 3.90 8.56 8.69 0.25 0.38 0.41 0.84 0 4 0.20 0.23 0.36 0.42 0 12 0 12 A1
MIN
MAX
MIN
MAX
Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic
.053 .052 .004 .228 .150 .337 .010 .016 0 .008 .014 0 0
.069 .061 .010 .244 .157 .347 .020 .050 8 .010 .020 15 15
1.75 1.55 0.25 6.20 3.99 8.81 0.51 1.27 8 0.25 0.51 15 15
Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-065
2003 Microchip Technology Inc.
DS11195C-page 27
MCP41XXX/42XXX
14-Lead Plastic Thin Shrink Small Outline (ST) - 4.4 mm (TSSOP)
E E1 p
D 2 n B 1
A c
L A1 A2
Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Molded Package Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic
Units Dimension Limits n p A A2 A1 E E1 D L c B
MIN
INCHES NOM 14 .026 .035 .004 .251 .173 .197 .024 4 .006 .010 5 5
MAX
MIN
.033 .002 .246 .169 .193 .020 0 .004 .007 0 0
.043 .037 .006 .256 .177 .201 .028 8 .008 .012 10 10
MILLIMETERS* NOM MAX 14 0.65 1.10 0.85 0.90 0.95 0.05 0.10 0.15 6.25 6.38 6.50 4.30 4.40 4.50 4.90 5.00 5.10 0.50 0.60 0.70 0 4 8 0.09 0.15 0.20 0.19 0.25 0.30 0 5 10 0 5 10
Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. JEDEC Equivalent: MO-153 Drawing No. C04-087
DS11195C-page 28
2003 Microchip Technology Inc.
MCP41XXX/42XXX
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X Temperature Range /XX Package Examples:
a) b) c) d) e) f) g) h) i) a) b) c) d) e) f) g) h) i) j) k) l) m) n) o) MCP41010-I/SN: I-Temp., 8LD SOIC pkg. MCP41010-E/P: E-Temp., 8LD PDIP pkg. MCP41010T-I/SN: Tape and Reel, I-Temp., 8LD SOIC pkg. MCP41050-E/SN: E-Temp., 8LD SOIC pkg. MCP41050-I/P: I-Temp., 8LD PDIP pkg. MCP41050-E/SN: E-Temp., 8LD SOIC pkg. MCP41100-I/SN: I-Temp., 8LD SOIC package. MCP41100-E/P: E-Temp., 8LD PDIP pkg. MCP41100T-I/SN: I-Temp., 8LD SOIC pkg. MCP42010-E/P: MCP42010-I/SL: MCP42010-E/ST: MCP42010T-I/ST: MCP42050-E/P: MCP42050T-I/SL: MCP42050-E/SL: MCP42050-I/ST: MCP42050T-I/SL: MCP42050T-I/ST: MCP42100-E/P: MCP42100-I/SL: MCP42100-E/ST: MCP42100T-I/SL: MCP42100T-I/ST: E-Temp., 14LD PDIP pkg. I-Temp., 14LD SOIC pkg. E-Temp., 14LD TSSOP pkg. Tape and Reel, I-Temp., 14LD TSSOP pkg. E-Temp., 14LD PDIP pkg. Tape and Reel, I-Temp., 14LD SOIC pkg. E-Temp., 14LD SOIC pkg. I-Temp., 14LD TSSOP pkg. Tape and Reel, I-Temp., 14LD SOIC pkg. Tape and Reel, I-Temp., 14LD TSSOP pkg. E-Temp., 14LD PDIP pkg. I-Temp., 14LD SOIC pkg. E-Temp., 14LD TSSOP pkg. Tape and Reel, I-Temp., 14LD SOIC pkg. Tape and Reel, I-Temp., 14LD TSSOP pkg.
Device:
MCP41010: Single Digital Potentiometer (10 k) MCP41010T: Single Digital Potentiometer (10 k) (Tape and Reel) MCP41050: Single Digital Potentiometer (50 k) (Tape and Reel) MCP41050T: Single Digital Potentiometer (50 k) MCP41100: Single Digital Potentiometer (100 k) (Tape and Reel) MCP41100T: Single Digital Potentiometer (100 k) MCP42010: Dual Digital Potentiometer (10 k) MCP42010T: Dual Digital Potentiometer (10 k) (Tape and Reel) MCP42050: Dual Digital Potentiometer (50 k) MCP42050T: Dual Digital Potentiometer (50 k) (Tape and Reel) MCP42100: Dual Digital Potentiometer (100 k) MCP42100T: Dual Digital Potentiometer (100 k) (Tape and Reel)
Temperature Range:
I E P SN SL ST
= = = = = =
-40C to +85C -40C to +125C Plastic DIP (300 mil Body), 8-lead, 14-lead Plastic SOIC (150 mil Body), 8-lead Plastic SOIC (150 mil Body), 14-lead TSSOP (4.4mm Body), 14-lead
Package:
Sales and Support
Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2003 Microchip Technology Inc.
DS11195C-page 29
MCP41XXX/42XXX
NOTES:
DS11195C-page 30
2003 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: * * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
* *
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, MPLAB, PIC, PICmicro, PICSTART, PRO MATE and PowerSmart are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Accuron, Application Maestro, dsPICDEM, dsPICDEM.net, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, InCircuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICC, PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC, Select Mode, SmartSensor, SmartShunt, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2003, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company's quality system processes and procedures are QS-9000 compliant for its PICmicro(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001 certified.
2003 Microchip Technology Inc.
DS11195C-page 31
M
WORLDWIDE SALES AND SERVICE
AMERICAS
Corporate Office
2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: 480-792-7627 Web Address: http://www.microchip.com
ASIA/PACIFIC
Australia
Suite 22, 41 Rawson Street Epping 2121, NSW Australia Tel: 61-2-9868-6733 Fax: 61-2-9868-6755
Korea
168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934
Singapore
200 Middle Road #07-02 Prime Centre Singapore, 188980 Tel: 65-6334-8870 Fax: 65-6334-8850
China - Beijing
Unit 915 Bei Hai Wan Tai Bldg. No. 6 Chaoyangmen Beidajie Beijing, 100027, No. China Tel: 86-10-85282100 Fax: 86-10-85282104
Atlanta
3780 Mansell Road, Suite 130 Alpharetta, GA 30022 Tel: 770-640-0034 Fax: 770-640-0307
Taiwan
Kaohsiung Branch 30F - 1 No. 8 Min Chuan 2nd Road Kaohsiung 806, Taiwan Tel: 886-7-536-4818 Fax: 886-7-536-4803
Boston
2 Lan Drive, Suite 120 Westford, MA 01886 Tel: 978-692-3848 Fax: 978-692-3821
China - Chengdu
Rm. 2401-2402, 24th Floor, Ming Xing Financial Tower No. 88 TIDU Street Chengdu 610016, China Tel: 86-28-86766200 Fax: 86-28-86766599
Taiwan
Taiwan Branch 11F-3, No. 207 Tung Hua North Road Taipei, 105, Taiwan Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
Chicago
333 Pierce Road, Suite 180 Itasca, IL 60143 Tel: 630-285-0071 Fax: 630-285-0075
China - Fuzhou
Unit 28F, World Trade Plaza No. 71 Wusi Road Fuzhou 350001, China Tel: 86-591-7503506 Fax: 86-591-7503521
Dallas
4570 Westgrove Drive, Suite 160 Addison, TX 75001 Tel: 972-818-7423 Fax: 972-818-2924
EUROPE
Austria
Durisolstrasse 2 A-4600 Wels Austria Tel: 43-7242-2244-399 Fax: 43-7242-2244-393
China - Hong Kong SAR
Unit 901-6, Tower 2, Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431
Detroit
Tri-Atria Office Building 32255 Northwestern Highway, Suite 190 Farmington Hills, MI 48334 Tel: 248-538-2250 Fax: 248-538-2260
Denmark
Regus Business Centre Lautrup hoj 1-3 Ballerup DK-2750 Denmark Tel: 45-4420-9895 Fax: 45-4420-9910
China - Shanghai
Room 701, Bldg. B Far East International Plaza No. 317 Xian Xia Road Shanghai, 200051 Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
Kokomo
2767 S. Albright Road Kokomo, IN 46902 Tel: 765-864-8360 Fax: 765-864-8387
France
Parc d'Activite du Moulin de Massy 43 Rue du Saule Trapu Batiment A - ler Etage 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Los Angeles
18201 Von Karman, Suite 1090 Irvine, CA 92612 Tel: 949-263-1888 Fax: 949-263-1338
China - Shenzhen
Rm. 1812, 18/F, Building A, United Plaza No. 5022 Binhe Road, Futian District Shenzhen 518033, China Tel: 86-755-82901380 Fax: 86-755-8295-1393
Germany
Steinheilstrasse 10 D-85737 Ismaning, Germany Tel: 49-89-627-144-0 Fax: 49-89-627-144-44
Phoenix
2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7966 Fax: 480-792-4338
China - Shunde
Room 401, Hongjian Building No. 2 Fengxiangnan Road, Ronggui Town Shunde City, Guangdong 528303, China Tel: 86-765-8395507 Fax: 86-765-8395571
Italy
Via Quasimodo, 12 20025 Legnano (MI) Milan, Italy Tel: 39-0331-742611 Fax: 39-0331-466781
San Jose
2107 North First Street, Suite 590 San Jose, CA 95131 Tel: 408-436-7950 Fax: 408-436-7955
China - Qingdao
Rm. B505A, Fullhope Plaza, No. 12 Hong Kong Central Rd. Qingdao 266071, China Tel: 86-532-5027355 Fax: 86-532-5027205
Netherlands
Toronto
6285 Northam Drive, Suite 108 Mississauga, Ontario L4V 1X5, Canada Tel: 905-673-0699 Fax: 905-673-6509
India
Divyasree Chambers 1 Floor, Wing A (A3/A4) No. 11, O'Shaugnessey Road Bangalore, 560 025, India Tel: 91-80-2290061 Fax: 91-80-2290062
P. A. De Biesbosch 14 NL-5152 SC Drunen, Netherlands Tel: 31-416-690399 Fax: 31-416-690340
United Kingdom
505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44-118-921-5869 Fax: 44-118-921-5820
07/28/03
Japan
Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa, 222-0033, Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122
DS11195C-page 32
2003 Microchip Technology Inc.

▲Up To Search▲

Price & Availability of MCP41010MCP42010

	To Download MCP41010MCP42010 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .